The Art of SoC Integration — Managing Complexity at 3nm
A deep-dive into how modern SoC integration workflows evolve as process nodes shrink — covering hierarchy planning, IP stitching, and cross-domain sign-off challenges.
About
VLSI professional with 8 years of excellence in RTL design and SoC integration, driving the complete design engineering lifecycle — from RTL through synthesis, timing signoff, and tape-out.
Currently MTS Engineer at AMD on 3nm SoC AI projects, driving UPF development, formal verification, LINT/CDC sign-off, and Conformal flows from non-tiled RTL to final PNR netlist — powering next-generation AI silicon.
Expertise
Career
Recognition
Credentials
Academic
Writing
A deep-dive into how modern SoC integration workflows evolve as process nodes shrink — covering hierarchy planning, IP stitching, and cross-domain sign-off challenges.
Practical observations on IEEE 1801 UPF intent, power domain crossings, and common pitfalls that only surface at gate-level simulation or formal verification.
What it actually means to build AI silicon — the gap between algorithmic intent and synthesisable RTL, and how design decisions at block-level ripple all the way to PPA.
More write-ups on the way — follow on LinkedIn for updates.
RTL Design Practice
A personal practice vault of SystemVerilog implementations covering everything from basic flip-flops to async FIFOs, APB protocol masters, cellular automata, and RISC-V CPU design. Each module is synthesisable, verified, and documented.
Contact
Open to discussions on semiconductor design challenges, AI accelerator architecture, and collaboration in the EDA/VLSI space.
At AMD Strategic Silicon, I work on 3nm AI SoC projects where every transistor matters. The world now runs on AI — and that AI runs on silicon. From RTL to tape-out, I ensure our chips deliver the performance, power, and area targets that keep AMD at the frontier of AI computing.